Hmc-electronics EP256 Kester Solder Paste Uživatelský manuál stáhnout pdf

Easy Profile

256HA

No-Clean Solderpaste

Product Description

Easy Profile

256HA is a no-clean, air or nitrogen

reflowable solder paste specifically designed to

provide maximum print characteristics and

solderability. EP256HA has been designed for

applications that require the ultimate activity with

respect to difficult to solder to components and

board surface metallizations. EP256HA is also

capable of stencil printing after downtimes of up to

90 minutes with an effective first print down to

20 mils. EP256HA is a solder paste formula that

maintains its activity and printing characteristics

for up to 8 hours without any shear thinning.

• Excellent solderability on difficult to solder to

components, i.e., PdAg

• High activity on all substrates, including OSPs

• Excellent printing characteristics to 0.4mm

(16 mil) pitch with Type 3 powder

• Capable of 90 minute break times in printing

• High print speeds to 150 mm/sec (6 in/sec)

• Stencil life: 8+ hours (process dependent)

• Scrap is reduced due to less paste dry out

• Stable tack: 8+ hours

• Classified as ROL0 per J-STD-004

• Compatible with enclosed print head systems

Standard Applications

90% Metal - Stencil Printing

90% Metal - Enclosed Head Printing

Physical Properties

(Data given for Sn63Pb37 90% metal, -325+500 mesh)

Viscosity (typical):1800 poise

Malcom Viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 37 grams

Tested to Kester Method 1W-QC-3-04

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.3

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank EP256HA

Day 1

1.6 ×10

Ω 1.0 × 10

Ω

Day 4

9.9 ×10

Ω 2.1 × 10

Ω

Day 7

7.7 ×10

Ω 1.9 × 10

Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2

(800) 482-4440 1
Application Notes 2

Shrnutí obsahu

Strany 1 - (800) 482-4440

Easy ProfileEasy Profile®®256HA256HANo-Clean SolderpasteNo-Clean SolderpasteProduct DescriptionEasy Profile®256HA is a no-clean, air or nitrogenreflow

Strany 2 - Application Notes

Application NotesAvailability:Easy Profile® 256HA is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powdermesh is recommended, bu

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