Hmc-electronics Transplex Series Mini Compressed CleanFoam ESD Swa Uživatelský manuál stáhnout pdf (Strana 2)

ITW TEXWIPE DATATABLE

Physical Characteristics

Head material 100 ppi open-cell CleanFoam

Head width 3.5 mm (0.138")

Head thickness 3.5 mm (0.138")

Head length 10.0 mm (0.394")

Handle material Transplex

Handle width 3.0 mm (0.118")

Handle thickness 3.0 mm (0.118")

Handle length 79.0 mm (3.110")

Total swab length 89.0 mm (3.504")

Head bond Thermal

Handle color Translucent

Design notes Precision pointed tip; compact handle

Contamination Characteristics

Property Measurement Test Method*

Nonvolatile residue

IPA extractant 0.07 mg/swab TM10: Procedure for Determining the Nonvolatile Residue (NVR) Extractable

from Swabs in a Given Solvent

Ions The Determination of Ions by Ion Chromatography (IC)

Chloride 0.06 µg/swab

Sulfate 0.18 µg/swab

Nitrate <0.01 µg/swab

Phosphate 0.36 µg/swab

Fluoride <0.01 µg/swab

Potassium 0.03 µg/swab

Calcium <0.01 µg/swab

Sodium 1.12 µg/swab

Magnesium <0.01 µg/swab

Electrostatic Discharge Characteristics

Property Measurement Test Method

Handle resistivity 10 x 10

ohms/cm TM16: Determination of the Resistance per Unit Length (ohm/cm) of Swab

Handles. (Adapted from EOS/ESD-S11.11-1993.)

*Test procedures available upon request.

Mini Compressed CleanFoam

ESD Swab TX750E TX750D

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2

Žádné komentáře

Hmc-electronics Transplex Series Mini Compressed CleanFoam ESD Swa Uživatelský manuál Strana 2